Headquartered in Shenzhen, Orbbec was established in 2013 with a focus on vision technology. In 2015 it developed China’s first 3D sensing chip and its sensors were incorporated into Find X, an Oppo smartphone released in June 2018, becoming the first Android smartphone to be equipped with a 3D camera.
Orbbec’s edge is centred more in the computing technology that feeds from Time-of-Flight cameras that assess distances between the camera and the subject. Similar to how ultrasound uses sound waves to create an image, ToF uses light to measure shapes and movement. The raw data is then converted through algorithms and machine learning into recognisable images.
In May 2021 Orbbec announced a partnership with Microsoft to create a new cloud-based platform of ToF cameras to support functions including robotics, 3D scanning and surveillance. The cameras will be used in the logistics, manufacturing, retail, healthcare and fitness markets.
Orbbec is another of the unicorns hoping for a listing on the STAR Market. The company is said to be valued at $10 billion, with investors including Ant Financial, Hongde, SAIF Partners, MediaTek and CITIC.
© ChinTell Ltd. All rights reserved.
Sponsored by HSBC.
The Week in China website and the weekly magazine publications are owned and maintained by ChinTell Limited, Hong Kong. Neither HSBC nor any member of the HSBC group of companies ("HSBC") endorses the contents and/or is involved in selecting, creating or editing the contents of the Week in China website or the Week in China magazine. The views expressed in these publications are solely the views of ChinTell Limited and do not necessarily reflect the views or investment ideas of HSBC. No responsibility will therefore be assumed by HSBC for the contents of these publications or for the errors or omissions therein.